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【Know Molybdenum】What Are Required Characteristics for Molybdenum Sputtering Target?

What Are Required Characteristics for Molybdenum Sputtering Target?

1. Purity

At least 99.95% purity. The higher the purity, the better performance of the sputtered film. 

2. Density

The relative density should be above 98%. Higher density target can reduce the particle splashing of the film material during coating process, thereby improving the quality of the film.

3. Grain structure

With polycrystalline structure, target atoms are easily sputtered out along the most densely arranged directions of the hexagonal atoms. In order to achieve the highest sputtering rate, it is necessary to increase the sputtering rate by changing the crystalline structure of the target.

4. Grain size

The grain size can range from micrometers to millimeters. The sputtering rate of fine-grained targets is faster than that of coarse-grained targets, and targets with smaller crystal grain size differences have a more uniform thickness distribution of the deposited film.

5. Binding of target and chassis

The target must be connected to the oxygen-free copper chassis before sputtering, so that the target and the chassis have good thermal and electrical conductivity during the sputtering process. It should be made sure that the non-bonding area of these two parts is less than 2% after ultrasonic inspection, so as to meet the requirements of high-power sputtering.

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