PSS Patterned Sapphire Wafer Substrate Technology
- Details
- Category: Molybdenum & Sapphire Growth Furnace News
- Published on 26 February 2014
- Written by Cloudy
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In recent years, the rapid growth of the LED market , mainly because with high brightness and high efficiency LED products come out , LED applications growing popularity of the application from the phone 's LED lamp source vehicles, traffic signals, outdoor large monitors have applications instance. To meet the diverse needs of LED applications , the pursuit of higher LED brightness is an important trend in technology development.
PSS technology is to make some graphics on a sapphire substrate , the main purpose is to help LED manufacturers make their production of LED products , achieve higher brightness goals. PSS is by MEMS process technology , carved out on a sapphire substrate pattern after pattern on the substrate , can produce light refraction effect , so you can effectively enlarge the LED brightness . LED manufacturers over the use of the substrate by not adding the graphical process , there is no way to achieve the effect of refraction , once the PSS using a substrate , the brightness of the opportunity to increase compared to the original 20 % to 50% .
This technology began to mature in 2009 , China began to wheel into this technology, and the graphical substrate technology practice , previously carried out by wet etching process , but made less beautiful graphics , which can not reach the luminous efficiency. Then switch to dry etching approach , not only can reduce the time and cost , better luminous efficiency. PSS done through high power LED die , the previously required a few good brightness can be reached as long as one can now , can effectively reduce the cost and hope in the next two years in the lighting market, due to lower costs can reach popularity stimulate market demand.
In addition, the optical lens manufacturing process technology, China Wheel Through Wafer Level g Lens reflowable wafer level lens casting technology , the camera module mounting not only shorten the project time, and reduce cost and thickness. Currently on the market produced Wafer Level Lens mostly resin hybrid (Hybrid) plus a glass substrate , the disadvantage is that the production of complex structures, resulting in optical design and production difficulties , and will increase the thickness. China Wheel uses Casting produce a simple structure , and the thickness of the thin lens , as its advantages of technology products . Wide range of applications from mobile phones, laptops , game consoles , monitors, driving records , micro projectors , LED, hard drive read head , medical or industrial use , such as endoscopy .
To reduce the integrated circuit (IC) manufacturing costs , the world's leading semiconductor companies such as Intel, TSMC, and Samsung, Sematech development co-operation in the 450mm wafer manufacturing technology , is expected to be in volume production in 2015 . Wherein the chemical mechanical planarization (CMP) is one of the bottlenecks in production , however, Dr. Song Jianmin first ultrasound CMP, contact stress can significantly reduce the polishing of the wafer. This new technique , not only improves the efficiency of the CMP , but also reduces defects IC wafer.
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