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Damage-Free Separation of GaN Thin Films from Sapphire Substrates

Gallium nitride thin films grown on sapphire substrates were successfully separated and transferred onto Si substrates using single 38 ns KrF excimer laser pulses directed through the transparent substrate at fluences in the range of 400–600 mJ/cm². The absorption of the 248 nm radiation by the GaN at the interface induces rapid thermal decomposition of the interfacial layer, yielding metallic Ga and N2 gas. The substrate is easily removed by heating above the Ga melting point of 30 °C. Scanning electron microscopy and x-ray diffraction of the GaN films before and after lift-off demonstrate that the structural quality of the GaN films is not altered by the separation and transfer process.

High-quality gallium nitride (GaN) film was obtained for the first time using a GaN buffer layer on a sapphire substrate. An optically flat and smooth surface was obtained over a two-inch sapphire substrate. Hall measurement was performed on GaN films grown with a GaN buffer layer as a function of the thickness of the GaN buffer layer. For the GaN film grown with a 200 Å-GaN buffer layer, the carrier concentration and Hall mobility were 4×1016/cm3 and 600 cm²/V·s, respectively, at room temperature. The values became 8×1015/cm3 and 1500 cm2/V·s at 77 K, respectively. These values of Hall mobility are the highest ever reported for GaN films. The Hall measurement shows that the optimum thickness of the GaN buffer layer is around 200 Å.


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