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Sapphire Laser Processing for the New Ultra High-definition Display

 is a material widely used at present, it also has scratch resistance, impact resistance and flexibility of the various properties. Sapphire has long been used to make the watch glass or protective camera lens cover glass and filter glass, and now it is also increasingly used in the production of mobile phone screen. Sapphire glass plate by colorless synthetic corundum (fused alumina production which uses a variety of minerals) composition. In fact, strictly speaking, not a sapphire glass, its does not have a glassy amorphous structure, but a crystal structure. Because of its Mohs hardness of 9, sapphire ranking all transparent material hardness second only to diamond.

Due to the unique characteristics of sapphire, compared with the chemical commonly used for the display industry tempered glass, an advantage. Sapphire material hardness high but fragile, so only the help of advanced laser processing technology can be effectively applied to mass production. To this end, from Reutlingen, Germany-tech equipment manufacturer Manz Group has successfully developed two unique process according to customer demand, these two processes respective advantages: the use of short-pulse lasers microsecond "hot "laser beam cutting; using ultrashort pulse" cold "laser working method (so-called ultrashort pulsed laser pulse duration of only a few picoseconds). "Cold" laser processing section can provide better quality, but they are usually higher than for thermal cutting sapphire laser, can produce up to 300W mean output power of the fiber laser is more expensive.

Note: When using a laser beam cutting of brittle materials, the material is melted in the interaction region, requires the use of process gas is removed from the cutting edge.

No micro-cracks, no chipping

"Hot" laser cutting for cutting the cover glass of the outer contour and the inner contour, such as for mounting the camera, LED or the speaker hole. Typically, a glass substrate thickness of not more than 1 mm, polished after cutting thinning, final thickness between 600-800 microns. In this case, the cutting process is a melt: the energy transfer by way of the contact surface to be melt processable material, under the action of relatively high pressure gas blown out from the melt region of interaction. Thus, the cutting edge does not have residual melt, cooled again solidified damage edge quality. When using the "hot" laser processing technology, sapphire, sapphire does not produce micro-cracks or chipping. This method improves the sapphire cutting and bending resistance strength.




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