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WACKER Presents New Silicone Grades for Electronic and Medical-Technology Applications

PLASTIC Japan will see WACKER, a Munich-based chemical company, and Japanese silicone manufacturer Wacker Asahikasei Silicone unveiling innovative silicone products for the electronics, optoelectronics and medical-technology sectors. Among the products celebrating their premieres will be SEMICOSIL® 915 HT, a heat-resistant gel for encapsulating power electronic modules; LUMISIL® 868 S, an encapsulant for LED chips that prevents sedimentation of luminescent dyes; and LUMISIL® 885, a silicone rubber for producing optical lenses. Further product highlights will be SILPURAN® 2410 silicone rubber for orthopedic applications, and SILPURAN® 6610/40 liquid silicone rubber for radiation-sterilizable valves used in medical technology. PLASTIC Japan will be held in Tokyo from April 10 to 12.

New SEMICOSIL® 915 HT is one of the products to be exhibited by WACKER at PLASTIC Japan. This silicone gel is heat-resistant up to 210 degrees Celsius and is ideal for encapsulating power electronic modules.

Products to be presented by WACKER at PLASTIC Japan include a further development of its successful SEMICOSIL® silicones, which have served as electronics encapsulants for many years. SEMICOSIL® 915 HT, which is premiering in Tokyo, is a silicone gel that is characterized by extreme heat resistance after curing. This is evidenced by the fact that the mechanical properties of the cured rubber remains stable even after 2,000 hours' exposure to 210 degrees Celsius. The gel is therefore ideal for encapsulating power electronic modules. When regulating high electrical power, these modules can become so hot that conventional silicone gels fail.

The new gel is a two-component, addition-curing product. It is typically used to encapsulate power electronic modules employed in energy technology, high-speed trains and industrial plant. SEMICOSIL® 915 HT acts as a safeguard for manufacturers of power electronic modules against more exacting demands that will arise in the future, because the extremely heat-resistant encapsulant has the capacity to cope with much higher power densities than before. (By 4-Traders)


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