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Advantages of Heat Sinks and Semiconductor Base Plates Made from Molybdenum Copper Alloy

Thermal management and packaging components, such as heat spreaders and semiconductor base plates, are used to regulate the temperature of electronic systems and help to control operating temperatures of high-power semiconductor devices. 

Effective thermal management components use cost-effective, composite materials that possess high thermal conductivity and low thermal expansion.

Molybdenum copper high performance composites are fabricated from carefully controlled molybdenum that is vacuum infiltrated with molten copper. This results in a MoCu composite that has high conductivity and a matched low thermal expansion for heat sinks.

Molybdenum copper composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of molybdenum, molybdenum copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make molybdenum copper alloy an excellent choice even for extremely dense circuits.

It is a composite of molybdenum and copper. By controlling the content of molybdenum, we can design its coefficient of thermal expansion (CTE), matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Kovar, etc.

The advantages of heat sinks provided by Chinatungsten, heat spreaders, semiconductor base plates, and substrates lie in the thermal material properties. Their controlled CTE (coefficient of thermal expansion) perfectly matches with semiconductor and ceramic packaging materials. When used in combination with high TC (thermal conductivity), thermal management and packaging components remove heat rapidly from high powered electronic devices.

The CTE of our materials is adjustable whilst also maintaining high thermal conductivity, which makes our engineered thermal materials ideal for high-reliability electronics that generate considerable amounts of heat.

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