History of Molybdenum-Copper Alloy
- Details
- Category: Molybdenum knowledge
- Published on 23 September 2013
- Written by 陈桂兰
- Hits: 551
The 1960s, the former Soviet scholars have confirm molybdenum-copper alloy as the coefficient of expansion of fixed expansion alloys have been studied, the copper content of alloy expansion coefficient of the material.
1970s, the domestic molybdenum-copper alloy had set as high thermal expansion of the semiconductor substrate power tube been developed, which is higher than the thermal conductivity of pure molybdenum and aluminum, and oxygen-free copper expansion coefficient is lower than its coefficient of expansion and ceramic materials such as silicon good match.
1980s, by adding a small amount of molybdenum copper nickel or other elements used for sealing the ceramic non-magnetic metal material chord sealing the pressure sensor from the vibration-type temperature compensation of the non-magnetic material fixed expansion. However, due to various constraints, these efforts have not been very good promotion, the application of a single narrow object comparison, the amount is very small.
The late 1980s, foreign molybdenum copper alloy tubes and vacuum switches as electrical switches for electrical contacts in the production and application, while the development of microelectronic devices such as LSI heat sink material in. Table 1 lists the molybdenum as a heat sink material copper alloy composition and associated thermal performance. After 90 years, the country through the introduction of technology, also produces molybdenum-copper contacts using a vacuum switch tube, and heat sink materials research molybdenum copper alloy.
The 1960s, the former Soviet scholars have certain molybdenum-copper alloy as the coefficient of expansion of fixed expansion alloys have been studied, the copper content of alloy expansion coefficient of the material.
1970s, the domestic molybdenum-copper alloy had set as high thermal expansion of the semiconductor substrate power tube been developed, which is higher than the thermal conductivity of pure molybdenum and aluminum, and oxygen-free copper expansion coefficient is lower than its coefficient of expansion and ceramic materials such as silicon good match.
1980s, by adding a small amount of molybdenum copper nickel or other elements used for sealing the ceramic non-magnetic metal material chord sealing the pressure sensor from the vibration-type temperature compensation of the non-magnetic material fixed expansion. However, due to various constraints, these efforts have not been very good promotion, the application of a single narrow object comparison, the amount is very small.
The late 1980s, foreign molybdenum copper alloy tubes and vacuum switches as electrical switches for electrical contacts in the production and application, while the development of microelectronic devices such as LSI heat sink material in. Table 1 lists the molybdenum as a heat sink material copper alloy composition and associated thermal performance. After 90 years, the country through the introduction of technology, also produces molybdenum-copper contacts using a vacuum switch tube, and heat sink materials research molybdenum copper alloy.
More molybdenum product: http://www.molybdenum.com.cn
Tel: 0592-5129696 Fax：0592-5129797
E-mail:
This email address is being protected from spambots. You need JavaScript enabled to view it.
Tungsten & Molybdenum Information Bank: http://i.chinatungsten.com
Tungsten News & Tungsten Prices, 3G Version: http://3g.chinatungsten.com
Tungsten News & Tungsten Price: http://www.chinatungsten.com
sales@chinatungsten.com