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Development of Molybdenum Copper Material Home and Abroad

The 1960s, the former Soviet scholars have certain molybdenum-copper material as determined coefficients of expansion expansion alloys have been studied, the copper content of the alloy expansion coefficient of the material. 1970s, the domestic copper molybdenum had given inflation as high thermal conductivity of the semiconductor substrate power tube been developed, which is higher than the thermal conductivity of pure molybdenum and aluminum, and oxygen-free copper expansion coefficient is lower than its coefficient of expansion and ceramic materials such as silicon good match. 80, by adding a small amount of molybdenum copper nickel or other elements used for sealing the ceramic non-magnetic metal material chord sealing the pressure sensor from the vibration-type temperature compensation of the non-magnetic material fixed expansion. However, due to various constraints, these efforts have not been very good promotion, the application of a single narrow object comparison, the amount is very small. The late 1980s, foreign material as the molybdenum-copper tubes and electrical switches vacuum switches the electrical contacts for the production and application, while the development of microelectronic devices such as LSI heat sink in. After 90 years, the country through the introduction of technology, also produces molybdenum-copper contacts using a vacuum switch tube, and heat sink materials research molybdenum copper alloy.

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