Molybdenum News Center

Application of Molybdenum Copper Alloy

1) The device requires high thermal conductivity, such as metal-ceramic tube UHF, power transistors and other requirements of good thermal conductivity as a high sealing position and a lower electrode and the silicon substrate, the thermal resistance can be reduced, increase stability and longevity. Mo-Cu and Mo-Cu2Ni the Ag2Cu good solder wettability, high quality sealing. However, the disadvantage of this material is not able to welding, so the application is limited. If the sheet can be made (thickness less than 1.1cm), it is possible for the device frame lead, as molybdenum - copper alloys have a better heat resistance (not soften after heating) and to meet the requirements of thermal conductivity properties.

2) molybdenum-copper sheet, molybdenum-copper composite sheet can be used as heat sink. -15% -18% Molybdenum, the thermal conductivity of the copper alloy of up to 160W / (m · K); copper-molybdenum-copper composite plate in the vertical direction to improve thermal conductivity than pure Mo 7% increase in the horizontal direction larger amplitude. 3) In addition to the above advantages molybdenum-copper alloy, but also has good heat resistance and high temperature strength. Its anti-gas ablative heat resistance and return to the atmosphere though, and tungsten copper alloy, but still better than some of the existing materials, so you can replace these materials to obtain new applications.

• < Prev
• Next >