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Analysis of the Advantages of Molybdenum-Copper Alloy in Electronic Packaging

Molybdenum-copper alloy plays an important role in electronic packaging, and is widely used in high-power and high-reliability electronic devices due to its excellent thermal management ability, matching thermal expansion coefficient, good mechanical strength and high temperature resistance.

With the progress of semiconductor technology, the requirements for packaging materials are getting higher and higher, and molybdenum copper will still be one of the important materials in this field and will play a greater role in packaging technology in the future. Its main advantages are as follows:

1. Superior thermal management performance

The molybdenum-copper material combines the low expansion of molybdenum with the high thermal conductivity of copper, making it an ideal heat dissipation material for high-power packages. Compared to tungsten copper (W-Cu), molybdenum copper has a lower density, which makes it easy to lightweight package, which is especially important in aerospace electronics.

2. Customizable CTE matching

The composition ratio of molybdenum copper can be adjusted according to specific application requirements, so that its thermal expansion coefficient matches different semiconductor materials, reducing thermal stress and improving package reliability.

3. High temperature resistance and corrosion resistance

Compared with pure copper or aluminum, molybdenum copper has better stability in high-temperature environments, is not easy to oxidize and deform, and is suitable for harsh environments, such as military electronics, aerospace and industrial power devices.

4. Excellent mechanical strength

Molybdenum copper material has higher hardness and strength than pure copper, which can provide good structural support and avoid deformation or damage of the package in a high-stress environment.

Typical areas of application

Due to the above advantages, molybdenum-copper alloys are widely used in the following fields:

Power semiconductor packaging (IGBT, MOSFET, SiC/GaN power modules)

RF and microwave devices (5G base stations, radar amplifiers)

Laser and optoelectronic packaging (laser diodes, LiDAR modules)

Aerospace and military electronics (high reliability packaging)

High-power LED lighting (automotive LEDs, UV LEDs)

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