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How to Optimize the Mechanical Properties of Molybdenum-Copper Alloy?
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2025-04-24 |
135 |
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How to Optimize the Thermal Management Performance of Molybdenum-Copper Alloys?
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2025-04-24 |
148 |
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Surface Treatment Technology of Molybdenum-Copper Alloy for Electronic Packaging
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2025-04-24 |
135 |
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Requirements for Molybdenum-Copper Alloy for 3D Packaging
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2025-04-24 |
163 |
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Optimization Strategy for Hermeticity and Reliability of Molybdenum-Copper Packages
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2025-04-24 |
116 |
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The Manufacturing Processes of Ultra-Thin Molybdenum Copper Heat Sinks
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2025-04-24 |
111 |
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Effect of Electroplating and Surface Treatment of Molybdenum-Copper Alloy on Packaging Performance
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2025-04-24 |
137 |
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Research on the Compatibility of Molybdenum-Copper Alloy with Semiconductor Chip Packaging
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2025-04-24 |
113 |
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Comparative Study of Molybdenum-Copper Alloy and Other Metal Packaging Materials
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2025-04-24 |
100 |
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Heat Dissipation Optimization of Molybdenum-Copper Alloy
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2025-03-27 |
109 |