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How to Optimize the Mechanical Properties of Molybdenum-Copper Alloy?
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2025-04-24 |
172 |
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How to Optimize the Thermal Management Performance of Molybdenum-Copper Alloys?
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2025-04-24 |
182 |
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Surface Treatment Technology of Molybdenum-Copper Alloy for Electronic Packaging
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2025-04-24 |
165 |
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Requirements for Molybdenum-Copper Alloy for 3D Packaging
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2025-04-24 |
185 |
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Optimization Strategy for Hermeticity and Reliability of Molybdenum-Copper Packages
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2025-04-24 |
132 |
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The Manufacturing Processes of Ultra-Thin Molybdenum Copper Heat Sinks
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2025-04-24 |
130 |
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Effect of Electroplating and Surface Treatment of Molybdenum-Copper Alloy on Packaging Performance
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2025-04-24 |
164 |
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Research on the Compatibility of Molybdenum-Copper Alloy with Semiconductor Chip Packaging
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2025-04-24 |
137 |
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Comparative Study of Molybdenum-Copper Alloy and Other Metal Packaging Materials
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2025-04-24 |
120 |
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Heat Dissipation Optimization of Molybdenum-Copper Alloy
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2025-03-27 |
126 |